Fabrication of low-roughness silicon acoustic lenses for high-frequency microelectromechanical system ultrasonic transducers using wet etching
摘要
Silicon (Si) acoustic lenses are widely used in single-element microelectromechanical system (MEMS) focused ultrasound transducers for focusing. However, existing studies on the effect of surface roughness of Si acoustic lenses on the focal region sound field and overall transducer performance are limited. This study uses the finite element method to design, simulate, and evaluate high-frequency focused ultrasound transducers incorporating Si acoustic lenses. The effects of the surface roughness of the Si acoustic lenses on the focal region acoustic field were examined and the overall transducer performance was investigated. Additionally, the effects of different etching window radii (40–400 μm) and stirring methods on the wet etching of Si acoustic lenses were examined to provide targeted optimization of the wet etching process used in the fabrication of MEMS focused ultrasound transducer Si lenses. Finally, based on the etched structures of the Si acoustic lenses, simulations were performed on ultrasound transducers to further validate the performance of the lenses. The results indicated that both transducers demonstrate an excellent focusing performance, with lateral resolutions of 6.88 and 11.44 μm, along with depths of field of 21.13 μm and 106.76 μm. This study provides essential insights into optimizing the fabrication of Si acoustic lenses for MEMS high-frequency focused ultrasound transducers.