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<p>Silver nanoparticles were sintered at atmospheric pressure using nitrogen plasma generated by diffuse coplanar surface barrier discharge (DCSBD). Compared to the standard thermal sintering of 1&#xa0;h at 140&#xa0;°C only 8&#xa0;min of nonthermal plasma treatment at 50&#xa0;°C were necessary to sufficiently anneal the silver nanoparticle film. Electrical resistivity as low as 9 × 10<sup>–6</sup>&#xa0;Ω&#xa0;cm was achieved, i.e., 17% of the bulk conductivity of silver. X-ray photoelectron spectroscopy was used to study the removal of organic moieties from the surface of the inkjet-printed layers. Scanning electron microscopy revealed in detail the process of formation of interconnection between nanoparticles. Our findings pave the way for implementing low-cost and eco-friendly DCSBD plasma sintering into continuous roll-to-roll processing in the future for the annealing of silver nanoparticles on substrates that cannot tolerate high temperatures.</p>

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Sintering of inkjet-printed silver nanoparticles by large-area atmospheric pressure nitrogen plasma

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年1月8日

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  • Julius Vida,
  • Selen Solak,
  • Yuhang Shao,
  • Tomáš Homola,
  • Emil List-Kratochvil,
  • Felix Hermerschmidt

摘要

Silver nanoparticles were sintered at atmospheric pressure using nitrogen plasma generated by diffuse coplanar surface barrier discharge (DCSBD). Compared to the standard thermal sintering of 1 h at 140 °C only 8 min of nonthermal plasma treatment at 50 °C were necessary to sufficiently anneal the silver nanoparticle film. Electrical resistivity as low as 9 × 10–6 Ω cm was achieved, i.e., 17% of the bulk conductivity of silver. X-ray photoelectron spectroscopy was used to study the removal of organic moieties from the surface of the inkjet-printed layers. Scanning electron microscopy revealed in detail the process of formation of interconnection between nanoparticles. Our findings pave the way for implementing low-cost and eco-friendly DCSBD plasma sintering into continuous roll-to-roll processing in the future for the annealing of silver nanoparticles on substrates that cannot tolerate high temperatures.