Enhance interface thermal conductivity by forming the cladding structure between grafting BN and phase change material

Boron nitride has good thermal conductivity and electrical insulation properties, which is conducive to meeting the high demand and rapid development of the third generation of power semiconductors. In this study, we propose to reduce interfacial scattering by BN grafting and crosslinking with polyethylene glycol to enhance the thermal conductivity of epoxy. The chemical grafting of KH570 and the crosslinking of epoxy resin ensure the effective heat transfer of the material. The grafting of BN can better form a cladding structure with polyethylene glycol and enhances thermal conductivity. The thermal conductivity of phase change material (PCMs-3) composite material reaches 1.51 Wm^− 1 K^− 1, which is 8.8 times that of pure epoxy resin. The heat transport process and thermal management ability are investigated based on the photothermal conversion in detail.