Laser rear-side ablation mechanism for ITO removal on PET substrate

To establish the optimal processing parameters, it is imperative to gain an understanding of the interactions and ablation mechanisms between the picosecond pulsed laser and indium tin oxide (ITO) films. This research employed a picosecond pulsed laser for rear-side ablation of ITO films on polyethylene terephthalate (PET) substrates. A two-dimensional simulation temperature analysis of groove morphology was used to evaluate the elimination of ITO films through thermal evaporation. A methodical study was conducted on the effect of various laser processing parameters on the quality of the etched groove on the film’s surface. The results highlighted the importance of combining laser power and scanning speed harmoniously to achieve superior groove performance. An increase in laser power coupled with a decrease in scanning speed resulted in a widening of laser grooves, increase in molten ridge heights, and a sharper line at the edge of grooves. At a scanning speed of 3000 mm/s and a power level of 1.10 W, optimal laser processing parameters were determined. This caused the groove’s edges to display precision, the molten ridge height to be minimized, the groove width to measure 24.7 mm, and the groove termini to be completely separated. The characteristics of these discernible grooves coincide with the requirements for pragmatic groove applications.