Mechanism and curing kinetics of epoxy resin toughened with polyethylene glycol modified Nanosilica
摘要
Inorganic nanoparticles have shown significant potential in overcoming the inherent limitations of conventional epoxy resins, particularly their inadequate stiffness and strength during service. This enhancement has considerably broadened their applicability in various fields of advanced composites. However, a serious challenge remains in enabling them to also exert a toughening effect on the epoxy matrix. In this study, the epoxy resin was toughened by polyethylene glycol (PEG)-modified nano SiO2, and the mechanism and curing kinetics were investigated. The mechanical properties, thermal stability, and dynamic thermo-mechanical properties of the composites were evaluated. Furthermore, the dispersion mechanism of the modified SiO2 in the epoxy resin was probed, and the curing kinetic model of the epoxy composites was established. The results showed that the dispersion of the modified SiO2 in the epoxy resin was improved, and the tensile strength, impact toughness and fracture toughness (KIC) of the epoxy composites were optimized when adding 3 wt% modified nanoparticles, showing the enhancements of 26.89%, 31.32% and 75%, respectively. The toughening agent at low content could reduce the reaction activation energy of the matrix by 16.43%. This study aims to provide a new avenue of effective toughening to achieve improved performance of composites for wide application, and to clarify the mechanism and curing kinetics for understanding its contribution.