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<p>Thermal management material with excellent thermal conductivity is a key factor to the long-time operation of electronic elements. In this work, the polydopamine (PDA) modified boron nitride (BN-PDA) platelets were combined with polydimethylsiloxane (PDMS) to fabricate BN-PDA/PDMS composites to achieve enhanced mechanical properties and stable thermal conductivity performance under cyclic compression and thermo-oxidative testing conditions. The PDA functionalization of hexagonal boron nitride (h-BN) improved the dispersion and interfacial compatibility between h-BN platelets and PDMS matrix, which could benefit for the generation of effective thermal conducting route. The thermal conductivity of BN-PDA/PDMS composite at 26.7 wt% filler content (0.91&#xa0;W/mK) was 807% higher than that of pure PDMS and 15.2% higher than that of BN/PDMS composite with the same filler content. Moreover, the BN-PDA/PDMS composites also possessed satisfied mechanical properties. Compared with BN/PDMS composites, the tensile strength, storage modulus and hardness of PDMS were all enhanced by incorporating BN-PDA. Importantly, both the thermal conductivity and mechanical properties of the BN-PDA/PDMS composites varied slightly after multiple cyclic compression and thermo-oxidative aging tests, which will benefit for the long-term service in microelectronics packaging or other fields regarding as thermal interface materials.</p>

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Enhanced thermal conductivity and mechanical properties of polydimethylsiloxane composites using polydopamine functionalized boron nitride

  • 期刊论文

  • 发表日期：

    2025年12月12日

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  • Xue Ke,
  • Liyi Liu,
  • Lei Guo,
  • Feng You,
  • Xueliang Jiang,
  • Chenjian Li,
  • Wei Zhu

摘要

Thermal management material with excellent thermal conductivity is a key factor to the long-time operation of electronic elements. In this work, the polydopamine (PDA) modified boron nitride (BN-PDA) platelets were combined with polydimethylsiloxane (PDMS) to fabricate BN-PDA/PDMS composites to achieve enhanced mechanical properties and stable thermal conductivity performance under cyclic compression and thermo-oxidative testing conditions. The PDA functionalization of hexagonal boron nitride (h-BN) improved the dispersion and interfacial compatibility between h-BN platelets and PDMS matrix, which could benefit for the generation of effective thermal conducting route. The thermal conductivity of BN-PDA/PDMS composite at 26.7 wt% filler content (0.91 W/mK) was 807% higher than that of pure PDMS and 15.2% higher than that of BN/PDMS composite with the same filler content. Moreover, the BN-PDA/PDMS composites also possessed satisfied mechanical properties. Compared with BN/PDMS composites, the tensile strength, storage modulus and hardness of PDMS were all enhanced by incorporating BN-PDA. Importantly, both the thermal conductivity and mechanical properties of the BN-PDA/PDMS composites varied slightly after multiple cyclic compression and thermo-oxidative aging tests, which will benefit for the long-term service in microelectronics packaging or other fields regarding as thermal interface materials.