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<p>Electromagnetic interference (EMI) shielding is crucial for ensuring the reliable operation and protection of modern electronic systems against unwanted electromagnetic radiation. The present research focuses on the development and evaluation of composites with enhanced EMI shielding efficiency, along with their mechanical, dielectric and thermal properties. Among the developed materials, the RCS2 composite containing 3 vol% silicon carbide (SiC) exhibited superior mechanical performance, achieving a tensile strength of 148&#xa0;MPa, tear strength of 39&#xa0;MPa and shore-D hardness of 95, attributed to the synergistic reinforcement effect of <i>Celosia cristata</i> stem fiber and ceramic filler. In contrast, the RCS3 composite with 5 vol% SiC demonstrated the highest EMI shielding effectiveness, ranging from 23.4&#xa0;dB at 8&#xa0;GHz to 53.3&#xa0;dB at 18&#xa0;GHz, along with improved thermal conductivity (0.68 W/mK), dielectric permittivity (4.9) and dielectric loss (0.75). These enhancements are a result of the high thermal and electrical conductivity of SiC, which promotes phonon and charge transport, interfacial polarization and electromagnetic wave absorption. SEM analysis further supports the uniform dispersion and effective interaction of the fillers within the matrix. Given these multifunctional properties, the developed composites are promising candidates for use in electronic enclosures, automotive and aerospace interiors, EMI shielding films, thermal management systems and smart packaging applications.</p>

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Performance evaluation of PVA composites reinforced with macadamia shell-based silicon carbide and natural fibers for EMI shielding applications

  • 期刊论文

  • 发表日期：

    2025年9月22日

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  • Seeniappan Kaliappan,
  • Naveen Kilari,
  • L. Natrayan,
  • M.Muthukannan,
  • M. Ramya,
  • Sathish Kannan,
  • Vinayagam Mohanavel,
  • Manzoore Elahi M. Soudagar

摘要

Electromagnetic interference (EMI) shielding is crucial for ensuring the reliable operation and protection of modern electronic systems against unwanted electromagnetic radiation. The present research focuses on the development and evaluation of composites with enhanced EMI shielding efficiency, along with their mechanical, dielectric and thermal properties. Among the developed materials, the RCS2 composite containing 3 vol% silicon carbide (SiC) exhibited superior mechanical performance, achieving a tensile strength of 148 MPa, tear strength of 39 MPa and shore-D hardness of 95, attributed to the synergistic reinforcement effect of Celosia cristata stem fiber and ceramic filler. In contrast, the RCS3 composite with 5 vol% SiC demonstrated the highest EMI shielding effectiveness, ranging from 23.4 dB at 8 GHz to 53.3 dB at 18 GHz, along with improved thermal conductivity (0.68 W/mK), dielectric permittivity (4.9) and dielectric loss (0.75). These enhancements are a result of the high thermal and electrical conductivity of SiC, which promotes phonon and charge transport, interfacial polarization and electromagnetic wave absorption. SEM analysis further supports the uniform dispersion and effective interaction of the fillers within the matrix. Given these multifunctional properties, the developed composites are promising candidates for use in electronic enclosures, automotive and aerospace interiors, EMI shielding films, thermal management systems and smart packaging applications.