Recovery of PdEDTA2− complex from electroless plating solutions using nitrogen-functionalized chitosan derivative
摘要
Currently, palladium (Pd(II))-based material is in high demand due to its wide applications in automobiles, electronic circuits, hydrogen purification, jewelry, dental, etc. However, the availability of the Pd(II) is a primary concern. Therefore, the need and necessity of effective eradication and retrieval of palladium (Pd(II)) are at higher priority from secondary sources. Utilizing nitrogen-functionalized groups of chitosan is effective for the eradication and retrieval from the eluents. This article presented a novel approach for the evaluation of the palladium adsorptive behavior of melamine-modified chitosan (CH-ME) resin from simulated electroless plating (ELP) solutions. The solution intricacy is associated with additives such as disodium ammonium hydroxide (NH4OH) and ethylenediaminetetraacetic acid (Na2EDTA). Obtained data have been considered to study the fitness of equilibrium, kinetic, and thermodynamic models. Pd(II) desorption characteristics were examined utilizing several simple eluents like HCl, H2SO4, KOH, and NaOH solutions with concentration variation of 0.1–2 N. Evaluated results conveyed that Pd(II) removal % and adsorption capacity of the resin altered as 81.50–51.35% and 22.64–85.58 mg g−1, respectively, and in the initial Pd(II) solution concentration range 50–300 mg L−1. Also, CH-ME provided higher extraction capabilities in comparison with the other chitosan derivatives.