Features of polymerization kinetics and heat realize of epoxy resin modified with silicone, silane and siloxane additives

The kinetics of polymerization of epoxy resin ED-20 cured with a polyethylene polyamine hardener modified with silicone rubber, tris(trimethylsiloxy) phenylsilane, octamethyl cyclotetrasiloxane is studied. A more rapid decrease in the amount of epoxy groups in systems modified with silicon-contained additives during polymerization is observed. A differential equation describing the change in changes in the concentration of epoxy groups with the polymerization time is proposed. The found exact solution to the proposed equation describes adequately the experimental data. The modification of epoxy binder reduces the time and temperature of the maximum heat release during the curing. The modification with the addition of tris(trimethylsiloxy) phenylsilane leads to the maximum increase in heat release. A differential equation describing the change in the heat release temperature with the curing time is formulated. The exact solution to the equation formulated is found, which is applied to estimate the curing end time of the compositions.