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<p>Effective heat dissipation from the semiconductor chip surface is paramount for appropriate thermal management. Its increasing usage in day-to-day devices creates a need to design augmented cooling systems where pulsating heat pipes (PHPs) have shown promising results. So, a geometrically modified tubular pulsating heat pipe design called “common header tubular pulsating heat pipe (abbreviated as CHTPHP)” is proposed in this study. The flat design of the evaporator and condenser sections facilitates an open internal volume, which is anticipated to facilitate the adequate mixing of the working fluid in tubular PHPs, mitigating thermal gradient and dry-outs. This modified design is also beneficial in maintaining the device’s compactness, as it accommodates a similar volume of fluid as a closed-loop PHP in less height. A wide range of experiments were conducted on the modified PHP design (CHTPHP) with three different volumetric filling ratios (FR) of 45%, 55%, and 67%, which are active oscillation ratios as reported by previous researchers (Shafii et al., J Heat Transf 123:1159–1172, <CitationRef CitationID="CR1">2001</CitationRef>) for vertical orientation operation, with heat loads varying from 5—28 W. Considering the realistic operating conditions for semiconductor devices, the experiments are carried out for condenser temperature of 20, 25 and 30&#xa0;°C. Any increase in condenser temperature decreases the thermal gradient, affecting the driving forces, so the effect on the working of the device is explored in this study. The device was tested using Acetone, Methanol, and Ethanol as working fluids. The results highlight that acetone at 67% FR performs better for the proposed CHTPHP design under different set condenser temperatures. The lowest resistance of 1.6&#xa0;°C/W is observed for acetone as a working fluid with a 67% filling ratio at 30&#xa0;°C condenser temperature.</p>

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Parametric study of a geometric modified common header tubular pulsating heat pipe

  • 期刊论文

  • 发表日期：

    2025年5月27日

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  • Sabyasachi Mohapatra,
  • Manoj Kumar Moharana

摘要

Effective heat dissipation from the semiconductor chip surface is paramount for appropriate thermal management. Its increasing usage in day-to-day devices creates a need to design augmented cooling systems where pulsating heat pipes (PHPs) have shown promising results. So, a geometrically modified tubular pulsating heat pipe design called “common header tubular pulsating heat pipe (abbreviated as CHTPHP)” is proposed in this study. The flat design of the evaporator and condenser sections facilitates an open internal volume, which is anticipated to facilitate the adequate mixing of the working fluid in tubular PHPs, mitigating thermal gradient and dry-outs. This modified design is also beneficial in maintaining the device’s compactness, as it accommodates a similar volume of fluid as a closed-loop PHP in less height. A wide range of experiments were conducted on the modified PHP design (CHTPHP) with three different volumetric filling ratios (FR) of 45%, 55%, and 67%, which are active oscillation ratios as reported by previous researchers (Shafii et al., J Heat Transf 123:1159–1172, 2001) for vertical orientation operation, with heat loads varying from 5—28 W. Considering the realistic operating conditions for semiconductor devices, the experiments are carried out for condenser temperature of 20, 25 and 30 °C. Any increase in condenser temperature decreases the thermal gradient, affecting the driving forces, so the effect on the working of the device is explored in this study. The device was tested using Acetone, Methanol, and Ethanol as working fluids. The results highlight that acetone at 67% FR performs better for the proposed CHTPHP design under different set condenser temperatures. The lowest resistance of 1.6 °C/W is observed for acetone as a working fluid with a 67% filling ratio at 30 °C condenser temperature.