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<p>In order to enhance the heat dissipation effect of high heat flow density electronic devices and prolong the service life of electronic devices. In this paper, a new type of the leaf-veined mini-channel heat sink (LVMCHS) was proposed based on the bionic blade structure. Numerical simulation technology was used to study the fluid flow, heat transfer and entropy generation characteristics of the LVMCHS. The experimental test platform was constructed for experimental verification. The orthogonal experiment was designed by using water as the coolant. The effects of <i>Re</i>, coolant inlet temperature <i>T</i><sub><i>in</i></sub> and heat flux <i>Q</i><sub><i>w</i></sub> on the pressure drop Δ<i>P</i>, total thermal resistance <i>R</i><sub><i>th</i></sub>, average Nusselt number <i>Nu</i><sub><i>avg</i></sub> and total entropy generation <i>S</i><sub><i>gen</i></sub> of the LVMCHS were studied. Polar deviation analysis showed that the order of the influence of each factor on the temperature uniformity (TUF) was <i>Q</i><sub><i>w</i></sub>&gt;<i>Re</i> &gt; <i>T</i><sub><i>in</i></sub>, and the order of the influence of each factor on <i>Nu</i><sub><i>avg</i></sub> was <i>Re</i> &gt; <i>T</i><sub><i>in</i></sub>&gt;<i>Q</i><sub><i>w</i></sub>. When the <i>Re</i> was in the range of 300 ~ 10,000, with the increase of <i>Re</i>, the <i>R</i><sub><i>th</i></sub> decreased by 92.59%, and <i>S</i><sub><i>gen</i></sub> decreased by 15.764%. At <i>Re</i> = 9970, its <i>S</i><sub><i>gen</i></sub> reached the lowest value of 171.57, the integrated heat transfer performance of the LVMCHS was optimal. Through the trend of the influence of each factor level, the better combination of programmer levels was obtained: when the <i>Q</i><sub><i>w</i></sub> was 35&#xa0;W/cm<sup>2</sup>, the <i>Re</i> was 9970 and the <i>T</i><sub><i>in</i></sub> was 5&#xa0;°C. This study provided a novel approach and guidance for the design and analysis of heat sink.</p>

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Experimental and simulation study of flow and heat transfer characteristics of the leaf-veined mini-channel heat sink

  • 期刊论文

  • 发表日期：

    2025年3月20日

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  • Weixue Cao,
  • Tianqi Shao,
  • Xudong Zhang,
  • Yixuan Zhang,
  • Yongzhen Wang

摘要

In order to enhance the heat dissipation effect of high heat flow density electronic devices and prolong the service life of electronic devices. In this paper, a new type of the leaf-veined mini-channel heat sink (LVMCHS) was proposed based on the bionic blade structure. Numerical simulation technology was used to study the fluid flow, heat transfer and entropy generation characteristics of the LVMCHS. The experimental test platform was constructed for experimental verification. The orthogonal experiment was designed by using water as the coolant. The effects of Re, coolant inlet temperature Tin and heat flux Qw on the pressure drop ΔP, total thermal resistance Rth, average Nusselt number Nuavg and total entropy generation Sgen of the LVMCHS were studied. Polar deviation analysis showed that the order of the influence of each factor on the temperature uniformity (TUF) was Qw>Re > Tin, and the order of the influence of each factor on Nuavg was Re > Tin>Qw. When the Re was in the range of 300 ~ 10,000, with the increase of Re, the Rth decreased by 92.59%, and Sgen decreased by 15.764%. At Re = 9970, its Sgen reached the lowest value of 171.57, the integrated heat transfer performance of the LVMCHS was optimal. Through the trend of the influence of each factor level, the better combination of programmer levels was obtained: when the Qw was 35 W/cm2, the Re was 9970 and the Tin was 5 °C. This study provided a novel approach and guidance for the design and analysis of heat sink.