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<p>The addition of materials such as polysulfone as a modifier to epoxy binders has the potential to significantly improve the crack resistance of the material. In this work, the effect of the polyphenylene sulfone additive on the epoxy resin strength has been studied experimentally. Epoxy samples were cured at 160 and <InlineEquation ID="IEq5"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="193_2025_1224_Article_IEq2.gif" Format="GIF" Height="14" Rendition="HTML" Resolution="72" Type="Linedraw" Width="46" /> </InlineMediaObject> <EquationSource Format="TEX">\(200\,^{\circ }\hbox {C}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <mn>200</mn> <mmultiscripts> <mspace width="0.166667em" /> <mrow /> <mo>∘</mo> </mmultiscripts> <mtext>C</mtext> </mrow> </math></EquationSource> </InlineEquation> temperature. Under static conditions, the addition of 5% polyphenylene sulfone to epoxy cured at <InlineEquation ID="IEq6"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="193_2025_1224_Article_IEq2.gif" Format="GIF" Height="14" Rendition="HTML" Resolution="72" Type="Linedraw" Width="46" /> </InlineMediaObject> <EquationSource Format="TEX">\(200\,^{\circ }\hbox {C}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <mn>200</mn> <mmultiscripts> <mspace width="0.166667em" /> <mrow /> <mo>∘</mo> </mmultiscripts> <mtext>C</mtext> </mrow> </math></EquationSource> </InlineEquation> leads to strength increase. Under dynamic loading, the spall strength decreased with increased polyphenylene sulfone addition in all epoxy resin samples. When the incoming pulse pressure is low, the spall strength of the samples cured at both temperatures is similar. The curing temperature effect begins to manifest itself at higher incoming pulse pressures in samples with 3–5% of polyphenylene sulfone. Curing temperature affects the characteristics of the spall fracture kinetics as well.</p>

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Spall strength measurements of epoxy resin with varying polyphenylene sulfone content cured at \(160\,^{\circ }\hbox {C}\) and \(200\,^{\circ }\hbox {C}\) temperature

  • 期刊论文

  • 发表日期：

    2025年5月5日

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  • V. Mochalova,
  • A. Utkin,
  • A. Savinykh,
  • G. Garkushin,
  • D. Nikolaev,
  • A. Savchenko,
  • A. Kapasharov,
  • G. Malkov

摘要

The addition of materials such as polysulfone as a modifier to epoxy binders has the potential to significantly improve the crack resistance of the material. In this work, the effect of the polyphenylene sulfone additive on the epoxy resin strength has been studied experimentally. Epoxy samples were cured at 160 and \(200\,^{\circ }\hbox {C}\) 200 ∘ C temperature. Under static conditions, the addition of 5% polyphenylene sulfone to epoxy cured at \(200\,^{\circ }\hbox {C}\) 200 ∘ C leads to strength increase. Under dynamic loading, the spall strength decreased with increased polyphenylene sulfone addition in all epoxy resin samples. When the incoming pulse pressure is low, the spall strength of the samples cured at both temperatures is similar. The curing temperature effect begins to manifest itself at higher incoming pulse pressures in samples with 3–5% of polyphenylene sulfone. Curing temperature affects the characteristics of the spall fracture kinetics as well.