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<p>Based on calculation of phase diagrams (CALPHAD)-assisted phase fraction calculations, Sn-1Ag-0.7Cu-5Bi-xIn (x = 4, 8, 15, 17 wt%, hereafter denoted as xIn) alloys were designed to meet long-term high-temperature service requirements in solder joints. Bi and In were added to offset performance losses resulting from reducing Ag content. With Bi fixed at 5 wt%, this study investigated the effects of varying In content on melting behavior, microstructure, mechanical properties, and fracture mechanisms. Results showed that increasing In content eliminated Bi-rich particles, and at ≥ 15 wt% In, InSn₄ phases appeared. The interfacial IMC transformed from Cu₆Sn₅ to Cu₆(Sn, In)₅, with the amount of InSn₄ and secondary phases increasing with In content. During isothermal aging at 170&#xa0;°C, the 4In joints formed Cu-rich layers, causing stress concentration and interfacial cracking. In the 8In joints, Cu and In diffusion converted Cu₆(Sn, In)₅ to Cu₃(Sn, In), generating residual stresses and interfacial cracks. Higher In contents lowered melting points, accelerated diffusion, and stabilized Cu₆(Sn, In)₅, thereby improving joint reliability. These findings provide valuable insights for controlling interfacial intermetallic compounds and designing solder joints.</p>

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Thermal behavior characterization and mechanical property degradation of Sn-1Ag-0.7Cu-5BixIn/Cu joints

  • 期刊论文

  • 发表日期：

    2026年5月27日

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  • Zhou Li,
  • Hao Yang,
  • Xiaojing Wang,
  • Yanlai Wang,
  • David P. Yan

摘要

Based on calculation of phase diagrams (CALPHAD)-assisted phase fraction calculations, Sn-1Ag-0.7Cu-5Bi-xIn (x = 4, 8, 15, 17 wt%, hereafter denoted as xIn) alloys were designed to meet long-term high-temperature service requirements in solder joints. Bi and In were added to offset performance losses resulting from reducing Ag content. With Bi fixed at 5 wt%, this study investigated the effects of varying In content on melting behavior, microstructure, mechanical properties, and fracture mechanisms. Results showed that increasing In content eliminated Bi-rich particles, and at ≥ 15 wt% In, InSn₄ phases appeared. The interfacial IMC transformed from Cu₆Sn₅ to Cu₆(Sn, In)₅, with the amount of InSn₄ and secondary phases increasing with In content. During isothermal aging at 170 °C, the 4In joints formed Cu-rich layers, causing stress concentration and interfacial cracking. In the 8In joints, Cu and In diffusion converted Cu₆(Sn, In)₅ to Cu₃(Sn, In), generating residual stresses and interfacial cracks. Higher In contents lowered melting points, accelerated diffusion, and stabilized Cu₆(Sn, In)₅, thereby improving joint reliability. These findings provide valuable insights for controlling interfacial intermetallic compounds and designing solder joints.