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<p>Ultra-precision grinding is a key enabling process for manufacturing high-performance hard-brittle components used in aerospace, optics, and semiconductor industries. This review systematically summarizes recent advances in ultra-precision grinding of hard-brittle materials from the perspectives of material removal mechanisms, key process technologies, and process–equipment integration. The review focuses on critical issues including ductile-regime grinding, grinding wheel fabrication and dressing, process monitoring, in-process metrology, and toolpath planning. Representative applications to optical lenses, large-aperture mirrors, semiconductor wafers, and microstructured functional surfaces are further discussed to illustrate the adaptability of ultra-precision grinding in different industrial contexts. On this basis, the current technical bottlenecks are analyzed, particularly in achieving high efficiency, high surface integrity, and high form accuracy simultaneously. Future development trends are also highlighted, including intelligent process control, multi-physics integrated optimization, and advanced ultra-precision equipment. This review provides a structured reference for understanding the latest progress and guiding future research and industrial development in ultra-precision grinding of hard-brittle materials.</p>

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​Advances in ultra-precision grinding of hard-brittle materials: critical technologies and equipment innovations

  • 期刊论文

  • 发表日期：

    2026年4月1日

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  • Haoxiang Wang,
  • Yong Feng,
  • Lei Zheng

摘要

Ultra-precision grinding is a key enabling process for manufacturing high-performance hard-brittle components used in aerospace, optics, and semiconductor industries. This review systematically summarizes recent advances in ultra-precision grinding of hard-brittle materials from the perspectives of material removal mechanisms, key process technologies, and process–equipment integration. The review focuses on critical issues including ductile-regime grinding, grinding wheel fabrication and dressing, process monitoring, in-process metrology, and toolpath planning. Representative applications to optical lenses, large-aperture mirrors, semiconductor wafers, and microstructured functional surfaces are further discussed to illustrate the adaptability of ultra-precision grinding in different industrial contexts. On this basis, the current technical bottlenecks are analyzed, particularly in achieving high efficiency, high surface integrity, and high form accuracy simultaneously. Future development trends are also highlighted, including intelligent process control, multi-physics integrated optimization, and advanced ultra-precision equipment. This review provides a structured reference for understanding the latest progress and guiding future research and industrial development in ultra-precision grinding of hard-brittle materials.