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<p>Silicon carbide (SiC) has become an increasingly important material for optical and semiconductor applications owing to its exceptional properties. However, its extreme hardness and brittleness pose significant challenges to traditional machining processes, leading to severe tool wear, low material removal rates, and suboptimal surface finishes. To overcome these issues, advanced field-assisted techniques like laser-assisted machining have emerged as promising solutions. This review provides a comprehensive overview of the mechanisms and recent advances in field-assisted machining processes of SiC, with a particular emphasis on laser-assisted machining. Critical research gaps are identified and a potential processing roadmap is outlined to pave the way for high-quality and efficient machining of SiC.</p>

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Mechanisms and advances in field assisted machining of SiC

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年3月14日

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  • Peixiong Wang,
  • Wenbin Zhong,
  • Maomao Wang,
  • Haodong Zhao,
  • Wenrui Wu,
  • Peixuan Yan,
  • Wenhan Zeng,
  • Xiangqian Jiang

摘要

Silicon carbide (SiC) has become an increasingly important material for optical and semiconductor applications owing to its exceptional properties. However, its extreme hardness and brittleness pose significant challenges to traditional machining processes, leading to severe tool wear, low material removal rates, and suboptimal surface finishes. To overcome these issues, advanced field-assisted techniques like laser-assisted machining have emerged as promising solutions. This review provides a comprehensive overview of the mechanisms and recent advances in field-assisted machining processes of SiC, with a particular emphasis on laser-assisted machining. Critical research gaps are identified and a potential processing roadmap is outlined to pave the way for high-quality and efficient machining of SiC.