Scholarlink

<p>As a key component in semiconductor equipment, the mass flow controller (MFC) regulates the gas delivery ratio in the reaction chamber of the equipment, the machining quality of the gas flow channels and seal surfaces in MFC valve also determines the accuracy and service life of the component. In industrial production, these features are often finished manually, which inevitably leads to inconsistent results. This article uses a novel sinter pouring polyurethane (SPPU) grind-polishing tool to process these features, and the tool can be used for automated ultra precision polishing of MFC valve features. Based on the properties of the tool, a theoretical model was established for the chip concentration and polishing force with polishing time during the process. Through experiments, it was found that the main defects of the polished surfaces are deep scratches and pits, and with the increase of feeding velocity, the changes in surface defects under different polishing pressures show completely opposite trends. In addition, it can be observed the relationship between the stability of instantaneous polishing force and the generation of surface defects. The greater the degree of force dispersion, the more obvious the surface defects after processing. This study can provide reference for the automated processing of MFC component.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Research on surface formation mechanism and defect control method in grind-polishing of MFC valve surface with a novel SPPU tool

  • 期刊论文

  • 发表日期：

    2026年2月16日

查看全文
  • Jun Chen,
  • Zhaozhi Guo,
  • Hao Wang,
  • Xiaoli Zhong,
  • Jingyu Li

摘要

As a key component in semiconductor equipment, the mass flow controller (MFC) regulates the gas delivery ratio in the reaction chamber of the equipment, the machining quality of the gas flow channels and seal surfaces in MFC valve also determines the accuracy and service life of the component. In industrial production, these features are often finished manually, which inevitably leads to inconsistent results. This article uses a novel sinter pouring polyurethane (SPPU) grind-polishing tool to process these features, and the tool can be used for automated ultra precision polishing of MFC valve features. Based on the properties of the tool, a theoretical model was established for the chip concentration and polishing force with polishing time during the process. Through experiments, it was found that the main defects of the polished surfaces are deep scratches and pits, and with the increase of feeding velocity, the changes in surface defects under different polishing pressures show completely opposite trends. In addition, it can be observed the relationship between the stability of instantaneous polishing force and the generation of surface defects. The greater the degree of force dispersion, the more obvious the surface defects after processing. This study can provide reference for the automated processing of MFC component.