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<p>Lithium niobate crystals play a crucial role in optoelectronics due to their exceptional optoelectronic and physicochemical properties. Nevertheless, lithium niobate exhibits low hardness and high brittleness, rendering it susceptible to surface defects during grinding. High-shear and low-pressure (HSLP) grinding enables the efficient and high-quality removal of brittle workpieces by applying low normal forces and high tangential forces. This study investigated HSLP grinding of lithium niobate using the flexible ball-end body-armor-like abrasive tool (BBAAT). The study examined the impact of various grinding parameters on surface finish and material removal. After grinding, the surface roughness (Ra) was significantly improved from an initial value of 307.2&#xa0;nm to 8.2&#xa0;nm. The BBAAT achieved a material removal depth of 114.92&#xa0;μm. The force ratio of HSLP grinding for lithium niobate was approximately 0.3, surpassing that of conventional grinding for brittle materials. The surface morphology revealed that the workpiece exhibited no noticeable defects following the grinding process. This investigation demonstrated the feasibility of the HSLP grinding for lithium niobate.</p>

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High-shear and low-pressure grinding with the ball-end body-armor-like abrasive tool for lithium niobate crystal: experimental investigation and theoretical analysis

  • 期刊论文

  • 发表日期：

    2026年1月15日

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  • Yebing Tian,
  • Chengwei Wei,
  • Xinyu Fan,
  • Zhuang Meng,
  • Yueqiang Zhao,
  • Yukang Zhao,
  • Hao Yun

摘要

Lithium niobate crystals play a crucial role in optoelectronics due to their exceptional optoelectronic and physicochemical properties. Nevertheless, lithium niobate exhibits low hardness and high brittleness, rendering it susceptible to surface defects during grinding. High-shear and low-pressure (HSLP) grinding enables the efficient and high-quality removal of brittle workpieces by applying low normal forces and high tangential forces. This study investigated HSLP grinding of lithium niobate using the flexible ball-end body-armor-like abrasive tool (BBAAT). The study examined the impact of various grinding parameters on surface finish and material removal. After grinding, the surface roughness (Ra) was significantly improved from an initial value of 307.2 nm to 8.2 nm. The BBAAT achieved a material removal depth of 114.92 μm. The force ratio of HSLP grinding for lithium niobate was approximately 0.3, surpassing that of conventional grinding for brittle materials. The surface morphology revealed that the workpiece exhibited no noticeable defects following the grinding process. This investigation demonstrated the feasibility of the HSLP grinding for lithium niobate.