<p>Grinding forces is one of the important factors affecting surface quality in the milling and grinding process. In order to study the influence of process parameters on grinding forces and the formation process and distribution of hole entrance defects. We establish a finite element model of ultrasonic vibration spiral milling hole making by constructing an ontological framework of fiber-matrix multi-phase heterogeneous structure, material anisotropy and damage evolution. Based on the finite element model, we analyzed the influence law of process parameters on grinding forces and the formation mechanism of surface defects on hole machining. The results show that the residual stresses on the workpiece are mainly distributed near the regions at the quadrant positions (90°, 180°, 270°, and 360°) of the hole, which are also the primary locations where tearing defects occur. Based on the experimental results, we verified the validity of the simulation model in terms of inlet morphology, defect characteristics and grinding forces, and the results provide a ground for exploring process measures to reduce defects in hole machining. Provide process technology support for the precision manufacturing and application of SiC<sub>f</sub>/SiC composites, and promote their wide application in the field of advanced equipment.</p>

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A study on the grinding forces and inlet defect formation mechanism in ultrasonic vibration spiral milling and grinding hole making of SiCf/SiC composite materials

  • Chengbo Gu,
  • Yanqing Zhou,
  • Xufeng Hao,
  • Ming Zhou

摘要

Grinding forces is one of the important factors affecting surface quality in the milling and grinding process. In order to study the influence of process parameters on grinding forces and the formation process and distribution of hole entrance defects. We establish a finite element model of ultrasonic vibration spiral milling hole making by constructing an ontological framework of fiber-matrix multi-phase heterogeneous structure, material anisotropy and damage evolution. Based on the finite element model, we analyzed the influence law of process parameters on grinding forces and the formation mechanism of surface defects on hole machining. The results show that the residual stresses on the workpiece are mainly distributed near the regions at the quadrant positions (90°, 180°, 270°, and 360°) of the hole, which are also the primary locations where tearing defects occur. Based on the experimental results, we verified the validity of the simulation model in terms of inlet morphology, defect characteristics and grinding forces, and the results provide a ground for exploring process measures to reduce defects in hole machining. Provide process technology support for the precision manufacturing and application of SiCf/SiC composites, and promote their wide application in the field of advanced equipment.