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<p>The dynamic formation process of electrochemical jet machining (ECJM) for hole drilling was systematically investigated through numerical simulation, and the key process parameters were optimized to enhance the machining quality of gas film cooling holes. A multi-physics coupling model integrating electric field, gas-liquid two-phase flow field, and geometric deformation was developed using COMSOL Multiphysics. The evolution of hole diameter and taper under various process conditions, as well as the dynamic distributions of the electric and flow fields, were analyzed in detail. It was observed that both hole diameter and taper increased with higher voltage and electrolyte conductivity. Meanwhile, an increased feed rate resulted in a reduced hole diameter but a greater taper. By employing the central composite design method, response surface models correlating process parameters with hole diameter and taper were established. Analysis of the response surface plots revealed that machining voltage had a significant influence on hole diameter, whereas feed rate predominantly affected taper formation. For target hole diameters of 0.5&#xa0;mm, 0.6&#xa0;mm, and 0.7&#xa0;mm, the optimal parameter combinations were determined through optimization, leading to a substantial improvement in hole machining accuracy and overall quality.</p>

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Multi-physics field coupling simulation analysis and process parameter optimization of ECJM hole-making process for superalloys

  • 期刊论文

  • 发表日期：

    2025年12月20日

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  • Zhiguo Wei,
  • Zhanshuang Wang,
  • Weiwei Liu,
  • Xiaolong Ying

摘要

The dynamic formation process of electrochemical jet machining (ECJM) for hole drilling was systematically investigated through numerical simulation, and the key process parameters were optimized to enhance the machining quality of gas film cooling holes. A multi-physics coupling model integrating electric field, gas-liquid two-phase flow field, and geometric deformation was developed using COMSOL Multiphysics. The evolution of hole diameter and taper under various process conditions, as well as the dynamic distributions of the electric and flow fields, were analyzed in detail. It was observed that both hole diameter and taper increased with higher voltage and electrolyte conductivity. Meanwhile, an increased feed rate resulted in a reduced hole diameter but a greater taper. By employing the central composite design method, response surface models correlating process parameters with hole diameter and taper were established. Analysis of the response surface plots revealed that machining voltage had a significant influence on hole diameter, whereas feed rate predominantly affected taper formation. For target hole diameters of 0.5 mm, 0.6 mm, and 0.7 mm, the optimal parameter combinations were determined through optimization, leading to a substantial improvement in hole machining accuracy and overall quality.