Combining residual network and bidirectional long short-term memory with additive attention for wafer defect classification
摘要
Accurate classification of wafer-map defect patterns is critical for boosting yield and reducing cost in semiconductor fabrication. To address this task, we combine the advantage of Residual Networks (ResNet)—their ability to minimize information loss in deep networks—with long short-term memory (LSTM) for sequence modeling over spatial tokens. We present the Shortcut3-ResNet with Five Sets and Bidirectional LSTM with Additive Attention Network (SCRBLAA-Net). A Shortcut3-ResNet with Five Sets (SCR5) block first distills spatial features; the resulting vector is reshaped into a pseudo-sequence and analyzed by an attention-augmented bidirectional LSTM (Bi-LSTM), after which the refined sequence is fused back with the original spatial representation. On the WM-811K dataset with the “none” class removed, SCRBLAA-Net achieves a macro-F1 of 93.99%, outperforming the baseline SCR5 by 1.59 percentage points and exceeding the SCR5–LSTM and SCR5–Bi-LSTM variants by 0.78 and 0.21 percentage points, respectively.