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<p>Carbon fiber-reinforced silicon carbide composite (C<sub>f</sub>/SiC) is a typical advanced material used for fabricating hot-end components in aircraft engines. Its properties, such as high hardness and anisotropy, create considerable challenges in processing. The complex machining behavior of this material often results in poor surface quality and severe tool wear during the conventional drilling process. This study employed a ultraviolet nanosecond laser to fabricate micro-holes with a diameter of 700&#xa0;μm and an aspect ratio of 3 in 2D-C<sub>f</sub>/SiC composites. In addition, this study investigates the laser drilling mechanisms in C<sub>f</sub>/SiC composites through numerical simulations and experiments. The effects of filling pattern, energy density <i>I</i>, scanning speed <i>v</i>, and hatch spacing <i>l</i> on the heat-affected zone (HAZ) and taper angle of the holes were investigated. Simulation results revealed that laser power and scanning speed significantly affected the temperature and stress distribution within the material. Concentric circle filling yields the best shape control at practical throughput, giving taper 3.80°, entrance HAZ 85.98&#xa0;μm, and time 21.14&#xa0;s per hole, whereas arc filling minimizes time but enlarges HAZ to 100.93&#xa0;μm. The taper angle exhibited a positive correlation with scanning speed and hatch spacing, and a negative correlation with energy density. The maximum HAZ width at the hole entrance showed a negative correlation with scanning speed and hatch spacing, but a positive correlation with energy density. Orthogonal experiments considering the heat-affected zone, taper angle, and drilling efficiency indicated that the optimal parameters were <i>v</i> = 400&#xa0;mm/s, <i>I</i> = 28&#xa0;J/cm², and <i>l</i> = 4&#xa0;μm, yielding a minimum HAZ of 42.41&#xa0;μm and a minimum processing time of 8.58&#xa0;s. Notably, defects such as crack propagation, oxide formation, and hole taper are associated with laser defocusing, material porosity, mismatched component properties, and thermal stress coupling.</p>

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Machining of micro-holes on Cf/SiC composite by ultraviolet nanosecond laser: simulation and experiment

  • 期刊论文

  • 发表日期：

    2025年11月6日

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  • Kai Wang,
  • Qiaoru Sun,
  • Haotian Yang,
  • Li Zhu,
  • Junping Li,
  • Xinyong Wang,
  • Jinhua Wei,
  • Liang Xu,
  • Guolong Zhao

摘要

Carbon fiber-reinforced silicon carbide composite (Cf/SiC) is a typical advanced material used for fabricating hot-end components in aircraft engines. Its properties, such as high hardness and anisotropy, create considerable challenges in processing. The complex machining behavior of this material often results in poor surface quality and severe tool wear during the conventional drilling process. This study employed a ultraviolet nanosecond laser to fabricate micro-holes with a diameter of 700 μm and an aspect ratio of 3 in 2D-Cf/SiC composites. In addition, this study investigates the laser drilling mechanisms in Cf/SiC composites through numerical simulations and experiments. The effects of filling pattern, energy density I, scanning speed v, and hatch spacing l on the heat-affected zone (HAZ) and taper angle of the holes were investigated. Simulation results revealed that laser power and scanning speed significantly affected the temperature and stress distribution within the material. Concentric circle filling yields the best shape control at practical throughput, giving taper 3.80°, entrance HAZ 85.98 μm, and time 21.14 s per hole, whereas arc filling minimizes time but enlarges HAZ to 100.93 μm. The taper angle exhibited a positive correlation with scanning speed and hatch spacing, and a negative correlation with energy density. The maximum HAZ width at the hole entrance showed a negative correlation with scanning speed and hatch spacing, but a positive correlation with energy density. Orthogonal experiments considering the heat-affected zone, taper angle, and drilling efficiency indicated that the optimal parameters were v = 400 mm/s, I = 28 J/cm², and l = 4 μm, yielding a minimum HAZ of 42.41 μm and a minimum processing time of 8.58 s. Notably, defects such as crack propagation, oxide formation, and hole taper are associated with laser defocusing, material porosity, mismatched component properties, and thermal stress coupling.