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<p>Laser-assisted machining of brittle materials has been confirmed to be effectual in enhancing the machinability because of the increased critical cutting depth for ductile removal machinability. However, there is not any accurate and effective method or model to calculate the critical cutting depth in laser-assisted machining of brittle materials. In the present research, the specific-cutting-energy-based model is extended for laser-assisted machining in consideration of the thermal effects induced by laser parameters, the material mechanical properties, tool structure parameters, and processing parameters in calculating the critical cutting depth. A series of scratch experiments on monocrystalline 4H-SiC workpiece, using monocrystalline diamond indenter with varying laser power, are put into effect to prove the proposed method. It is proved that the predicted results keep the same trend as the experimental results. The specific cutting energy at different cutting depths and different laser energies is analyzed in the ductile removal. At the same time, the scratch morphologies are analyzed by laser confocal equipment.</p>

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A predictive method of the critical cutting depth for ductile–brittle transition in laser-assisted machining of 4H-SiC

  • 期刊论文

  • 发表日期：

    2025年9月29日

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  • Qiang An,
  • Chuanzhen Huang,
  • Longhua Xu,
  • Zhenyu Shi,
  • Zhen Wang,
  • Shuiquan Huang,
  • Meina Qu,
  • Zhengkai Xu,
  • Dijia Zhang,
  • Baosu Guo,
  • Hanlian Liu,
  • Dun Liu,
  • Peng Yao

摘要

Laser-assisted machining of brittle materials has been confirmed to be effectual in enhancing the machinability because of the increased critical cutting depth for ductile removal machinability. However, there is not any accurate and effective method or model to calculate the critical cutting depth in laser-assisted machining of brittle materials. In the present research, the specific-cutting-energy-based model is extended for laser-assisted machining in consideration of the thermal effects induced by laser parameters, the material mechanical properties, tool structure parameters, and processing parameters in calculating the critical cutting depth. A series of scratch experiments on monocrystalline 4H-SiC workpiece, using monocrystalline diamond indenter with varying laser power, are put into effect to prove the proposed method. It is proved that the predicted results keep the same trend as the experimental results. The specific cutting energy at different cutting depths and different laser energies is analyzed in the ductile removal. At the same time, the scratch morphologies are analyzed by laser confocal equipment.