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<p>To study the stability and surface quality improvement in the localized and fixed-point polishing of wafers using giant electrorheological fluid (GERF), COMSOL is used to study the effects of single air dielectric, air and plexiglass dielectrics, and air, plexiglass and GERF dielectrics on the breakdown electric field strength. This reveals the location and cause of the breakdown, providing insights into the design and optimization of the insulation plate and the improvement of polishing stability. Additionally, the stability and shearing force of the GERF are tested. Finally, the feasibility and stability of localized and fixed-point polishing are verified using the developed device, GERF and an integrated tool electrode on corroded and ground wafers with different initial surface quality. The results demonstrate that polishing stability can be achieved using an insulated plate that is wider than the tool electrode, with a spindle speed of below 40&#xa0;rpm, a voltage of 2000&#xa0;V and a polishing gap of 0.3&#xa0;mm between the electrode and the workpiece. According to SEM and Ra analysis, the local errors of the corroded and ground wafers are improved. In particular, the Ra of the ground wafer decreases from 400 to 100&#xa0;nm, improving their surface quality by 75%. Therefore, it is feasible to improve the surface quality of wafers through localized and fixed-point polishing using GERF, providing a new approach to reducing local errors in the manufacturing process.</p>

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Stability and surface improvement in localized and fixed-point polishing of wafers using giant electrorheological fluid

  • 期刊论文

  • 发表日期：

    2025年9月1日

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  • Haihong Ai,
  • Kun Wang,
  • Jiajun Lin,
  • Xiaomin Xiong,
  • Zhanshan Wang

摘要

To study the stability and surface quality improvement in the localized and fixed-point polishing of wafers using giant electrorheological fluid (GERF), COMSOL is used to study the effects of single air dielectric, air and plexiglass dielectrics, and air, plexiglass and GERF dielectrics on the breakdown electric field strength. This reveals the location and cause of the breakdown, providing insights into the design and optimization of the insulation plate and the improvement of polishing stability. Additionally, the stability and shearing force of the GERF are tested. Finally, the feasibility and stability of localized and fixed-point polishing are verified using the developed device, GERF and an integrated tool electrode on corroded and ground wafers with different initial surface quality. The results demonstrate that polishing stability can be achieved using an insulated plate that is wider than the tool electrode, with a spindle speed of below 40 rpm, a voltage of 2000 V and a polishing gap of 0.3 mm between the electrode and the workpiece. According to SEM and Ra analysis, the local errors of the corroded and ground wafers are improved. In particular, the Ra of the ground wafer decreases from 400 to 100 nm, improving their surface quality by 75%. Therefore, it is feasible to improve the surface quality of wafers through localized and fixed-point polishing using GERF, providing a new approach to reducing local errors in the manufacturing process.