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<p>Fused deposition moulding (FDM), also known as additive manufacturing, is an accessible, cost-effective and versatile technique that facilitates the design of complex objects with high precision, while opening the door to innovative creations for both professionals and individuals. The process works by extruding a molten thermoplastic filament that is progressively deposited, layer by layer, to make the final object. The use of FDM in the packaging of microelectronic systems offers a number of advantages, particularly in terms of customisation, speed of production and cost reduction. By offering the possibility of manufacturing customised packages, adapted to specific applications, the main aim of this research is to analyse the influence of printing conditions on the quality of the object produced by the 3D printing technique and to assess how this method could optimise the manufacturing procedures for microelectronic system housings. A PLA polylactic acid material was used in this process in order to study the thermomechanical behaviour of this polymer. In this study, the impact of printing conditions on the quality of the 3D-printed part was investigated by changing the printing speed and layer thickness. To do this, two approaches were exploited: the first is numerical, including a multiphysics model, and the second is experimental, using a thermal camera to measure the temperature and a scanning electron microscope (SEM) to observe the details of the surface of the samples with extremely fine resolution. A point was selected in each sample to determine the temperature profile and residual stresses, and the data from the numerical model provides a credible method of predicting thermomechanical behaviour. The results show that reducing the printing speed leads to an increase in residual stresses of 12% and 13% for a thickness of 0.5&#xa0;mm and 15% and 10% for a thickness of 0.25&#xa0;mm. Analysis of the SEM images of the samples shows the impact of the printing conditions on the surface texture, in particular the filament width, the distance between filaments, the grey value and the cracking. These parameters are estimated by a maximum deviation of 22%, 96%, 27% and 35%, respectively. Implanting a 3D-printed case in a thermal relay improves thermal dissipation. The article suggests future research and an experimental study into the application of 3D printing in the microelectronic systems sector.</p>

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Effect of FDM process parameters on the residual stresses and surface mechanical properties in microelectronic systems 3D printing

  • 期刊论文

  • 发表日期：

    2025年7月30日

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  • Mohamed Houmimi,
  • Hamid Zaghar,
  • Nabil Moujibi

摘要

Fused deposition moulding (FDM), also known as additive manufacturing, is an accessible, cost-effective and versatile technique that facilitates the design of complex objects with high precision, while opening the door to innovative creations for both professionals and individuals. The process works by extruding a molten thermoplastic filament that is progressively deposited, layer by layer, to make the final object. The use of FDM in the packaging of microelectronic systems offers a number of advantages, particularly in terms of customisation, speed of production and cost reduction. By offering the possibility of manufacturing customised packages, adapted to specific applications, the main aim of this research is to analyse the influence of printing conditions on the quality of the object produced by the 3D printing technique and to assess how this method could optimise the manufacturing procedures for microelectronic system housings. A PLA polylactic acid material was used in this process in order to study the thermomechanical behaviour of this polymer. In this study, the impact of printing conditions on the quality of the 3D-printed part was investigated by changing the printing speed and layer thickness. To do this, two approaches were exploited: the first is numerical, including a multiphysics model, and the second is experimental, using a thermal camera to measure the temperature and a scanning electron microscope (SEM) to observe the details of the surface of the samples with extremely fine resolution. A point was selected in each sample to determine the temperature profile and residual stresses, and the data from the numerical model provides a credible method of predicting thermomechanical behaviour. The results show that reducing the printing speed leads to an increase in residual stresses of 12% and 13% for a thickness of 0.5 mm and 15% and 10% for a thickness of 0.25 mm. Analysis of the SEM images of the samples shows the impact of the printing conditions on the surface texture, in particular the filament width, the distance between filaments, the grey value and the cracking. These parameters are estimated by a maximum deviation of 22%, 96%, 27% and 35%, respectively. Implanting a 3D-printed case in a thermal relay improves thermal dissipation. The article suggests future research and an experimental study into the application of 3D printing in the microelectronic systems sector.