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<p>To address the issues of uneven magnetic field and suboptimal processing quality associated with the h-type magnetic compound fluid (MCF) polishing head, its finite element model was optimized for enhancing its structure, so as to achieve a more uniform magnetic field. By reconstructing the fluid model of the h-type polishing tool and employing the COMSOL Multiphysics software, advancements were made in the simulation of magneto-fluid coupling. This approach examined the uniformity in the distribution of fluid properties on deep-hole surfaces and the stability of the magnetic field during motion. The simulation revealed a 35% enhancement in the strength of the magnetic field. Based on these findings, the optimal experimental polishing parameters were established for various working conditions. In the conducted experiments, Cu H62 was used as the sample material. Also, different process parameters were applied, and comparisons were made between surface roughness and material removal rate before and after polishing. The experimental results showed that at a hole depth of 20&#xa0;mm, the average material removal rate improved to 0.897 mg/min under various conditions. Additionally, the surface roughness of the machined workpieces reduced to 200 nm in each case.</p>

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Optimized magnetic field: strategy for enhancing applicability and efficiency of deep-hole polishing heads through magneto-fluid coupling

  • 期刊论文

  • 发表日期：

    2025年6月23日

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  • Dawei Gao,
  • Yifan Xu,
  • Chen Jiang,
  • Yi Li,
  • Chunjin Wang

摘要

To address the issues of uneven magnetic field and suboptimal processing quality associated with the h-type magnetic compound fluid (MCF) polishing head, its finite element model was optimized for enhancing its structure, so as to achieve a more uniform magnetic field. By reconstructing the fluid model of the h-type polishing tool and employing the COMSOL Multiphysics software, advancements were made in the simulation of magneto-fluid coupling. This approach examined the uniformity in the distribution of fluid properties on deep-hole surfaces and the stability of the magnetic field during motion. The simulation revealed a 35% enhancement in the strength of the magnetic field. Based on these findings, the optimal experimental polishing parameters were established for various working conditions. In the conducted experiments, Cu H62 was used as the sample material. Also, different process parameters were applied, and comparisons were made between surface roughness and material removal rate before and after polishing. The experimental results showed that at a hole depth of 20 mm, the average material removal rate improved to 0.897 mg/min under various conditions. Additionally, the surface roughness of the machined workpieces reduced to 200 nm in each case.