Wear mechanism analysis of PCD tools during the cutting process of SiCp/Al with a 45% volume fraction using nanosecond pulsed laser-assisted cutting
摘要
Currently, SiC particle–reinforced aluminum matrix (SiCp/Al) materials are extensively utilized in industries. However, during the cutting process, the extrusion of the cutting tool onto the materials induces a significant stress concentration phenomenon, subsequently increasing tearing of the Al matrix as well as pull-out and fracture of the SiC particles. These phenomena can lead to severe cutting tool wear. Nanosecond pulsed laser–assisted cutting has been chosen for 45% volume fraction SiCp/Al to improve the cutting tool wear. The cutting simulation and experiments are used to analyze the types of cutting tool wear. The adjustment of pulsed laser power (0–50 W) and pulse width (0–100 ns) can effectively mitigate the cutting tool wear by inducing a thermal softening effect. The simulation and experimental results demonstrate that the utilization of the pulsed laser enhances the plastic deformation of the Al matrix and mitigates the fracture of the SiC particles, thereby potentially reducing abrasive wear on the cutting tools. The increase in pulse width and pulsed laser frequency may result in enhanced adhesive wear on the rake surface under elevated temperature conditions. Therefore, by adjusting the pulsed laser parameters, the interaction between the cutting tool and Al matrix as well as SiC particles can be improved during the cutting process, thereby reducing the cutting tool wear.