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<p>To improve the cruising range of electric vehicles (EVs), lithium-ion cells are assembled into modules that require efficient electrical circuits for power delivery. In fusion-based joining techniques, achieving a sufficiently high interfacial temperature is crucial to forming a robust joint between electrical wires and bond pads. However, such processes can lead to defects such as voids, cracks, segregation, or intermetallic compounds within the joint, which can compromise reliability and significantly shorten service life. Ultrasonic joining is a promising method for joining copper wires to copper pads, enabling reliable joints with sufficient strength at room temperature. As ultrasonic power and joining time increase, the resulting energy raises the interface temperature, enhances atomic interdiffusion, and strengthens the joint. However, excessive ultrasonic power (45 W) can cause over-deformation, material overflow, and thinning of the joint, ultimately reducing joint strength. Likewise, an excessively high joining load (270 N) suppresses ultrasonic energy transmission and limits interfacial motion and heating, thereby hindering atomic interdiffusion and resulting in unjoined regions that weaken the joint. Experimental results demonstrate that adequate parameters—28 W ultrasonic power, 0.3&#xa0;s joining time, and 108 N joining load—produce strong and reliable copper joints. This study successfully demonstrates the feasibility of ultrasonic joining of copper wires to bond pads at room temperature, highlighting its potential for application in the electrical circuits of lithium-ion battery modules.</p>

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Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits

  • 期刊论文

  • 发表日期：

    2025年5月30日

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  • Yu-Chi Cheng,
  • Chih-Ying Wen,
  • Cheng-Li Chuang

摘要

To improve the cruising range of electric vehicles (EVs), lithium-ion cells are assembled into modules that require efficient electrical circuits for power delivery. In fusion-based joining techniques, achieving a sufficiently high interfacial temperature is crucial to forming a robust joint between electrical wires and bond pads. However, such processes can lead to defects such as voids, cracks, segregation, or intermetallic compounds within the joint, which can compromise reliability and significantly shorten service life. Ultrasonic joining is a promising method for joining copper wires to copper pads, enabling reliable joints with sufficient strength at room temperature. As ultrasonic power and joining time increase, the resulting energy raises the interface temperature, enhances atomic interdiffusion, and strengthens the joint. However, excessive ultrasonic power (45 W) can cause over-deformation, material overflow, and thinning of the joint, ultimately reducing joint strength. Likewise, an excessively high joining load (270 N) suppresses ultrasonic energy transmission and limits interfacial motion and heating, thereby hindering atomic interdiffusion and resulting in unjoined regions that weaken the joint. Experimental results demonstrate that adequate parameters—28 W ultrasonic power, 0.3 s joining time, and 108 N joining load—produce strong and reliable copper joints. This study successfully demonstrates the feasibility of ultrasonic joining of copper wires to bond pads at room temperature, highlighting its potential for application in the electrical circuits of lithium-ion battery modules.