Ultrasound evaluation of the mechanical and interfacial properties of green test artifacts made by binder jetting for real-time quality monitoring
摘要
Binder jetting (BJ) is an additive manufacturing (AM) technique valued for its ability to produce complex geometries with a wide range of materials, including metals, ceramics, and composites, without the need for support structures. However, the BJ process faces significant challenges, such as green part fragility, leading to handling difficulties before sintering, density variations, which can cause anisotropic shrinkage and defects, and post-processing requirements, including sintering or infiltration, to achieve complete mechanical properties. This study presents a non-destructive evaluation (NDE) approach as a proof-of-concept for future in situ, real-time monitoring, employing compact, purpose-built witness coupons (artifacts) fabricated and ultrasonically inspected alongside the production build. Based on pulse-echo and pitch-catch transmission modes, waveform acquisition techniques were developed and applied to evaluate the mechanical and interfacial properties of green (SEGO) artifacts produced by BJ. Measurements of shell thickness, speed of sound, modulus of elasticity, and reflection coefficients were performed to characterize the build’s mechanical properties and internal structure. The reported results reveal anisotropy in material properties linked to process orientation and highlight dimensional inaccuracies in shell thickness. Additionally, powder core properties were estimated using reflection coefficient analysis, showcasing the potential of ultrasonic techniques for in situ quality monitoring. This work lays the foundation for developing real-time ultrasonic process monitoring systems for BJ AM, enhancing accuracy, defect detection, and waste minimization to improve overall process efficiency and part quality. The proof-of-concept study further details integrating real-time, in situ ultrasonic hardware and the artifact-based method into a binder-jet printer, specifying the system architecture required for future deployment. Additionally, this approach can be leveraged in the research and development phase to support process optimization and materials development.