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<p>Particle-reinforced composites (SiCp/Al) are widely used in aerospace and military industries due to their excellent properties. Pulsed laser heating of SiCp/Al softens the material, which reduces cutting forces, decreases tool wear and improves surface quality. In pulsed laser heating–assisted cutting of SiCp/Al, modeling of cutting force prediction is complicated by the laser’s involvement in the increase of material temperature and its property changes. Therefore, a cutting force prediction model was developed considering the effect of laser heating on the properties of SiCp/Al materials. In some of the previous studies, some have developed energy-based analytical force models for orthogonal cutting processes and conducted orthogonal cutting tests. Some decomposed the force generation mechanism into three factors: chip formation force, plowing force and particle breakage force. However, the effect of abrasive enhanced particles on the friction coefficient and friction angle was not considered in the above model. In this paper, firstly, the source of cutting force for conventional cutting of SiCp/Al composites is analyzed, and a cutting force model for conventional cutting is established, which divides the cutting force into four parts: chip forming force, frictional force, labor force and particle breaking force, and the effect of abrasive-enhanced particles is taken into account; secondly, the cutting temperature of pulsed laser–heating-assisted cutting of 25% of SiCp/Al is measured by experiments; lastly, to a more accurate simulation of cutting force, the influence of temperature on the performance of SiCp/Al material was considered, and the temperature-sensitive parameter was correlated with the temperature of pulsed laser heating–assisted cutting of SiCp/Al and introduced into the cutting force model of ordinary cutting of SiCp/Al, so that a cutting force model that considers the influence of laser heating on the performance of SiCp/Al was obtained and experimentally verified. After comparative analysis, the error between the predicted and experimental values is within 20%, which proves the feasibility of the prediction model and provides a theoretical basis for the subsequent pulsed laser heating–assisted SiCp/Al cutting.</p>

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Analytical modeling of cutting force in pulsed laser–assisted turnings of SiCp/Al composites

  • 期刊论文

  • 发表日期：

    2025年3月29日

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  • Mingming Lu,
  • Zhun Qiao,
  • Shuang Chen,
  • Jieqiong Lin,
  • Shuaijie Zhai,
  • Hong Gong

摘要

Particle-reinforced composites (SiCp/Al) are widely used in aerospace and military industries due to their excellent properties. Pulsed laser heating of SiCp/Al softens the material, which reduces cutting forces, decreases tool wear and improves surface quality. In pulsed laser heating–assisted cutting of SiCp/Al, modeling of cutting force prediction is complicated by the laser’s involvement in the increase of material temperature and its property changes. Therefore, a cutting force prediction model was developed considering the effect of laser heating on the properties of SiCp/Al materials. In some of the previous studies, some have developed energy-based analytical force models for orthogonal cutting processes and conducted orthogonal cutting tests. Some decomposed the force generation mechanism into three factors: chip formation force, plowing force and particle breakage force. However, the effect of abrasive enhanced particles on the friction coefficient and friction angle was not considered in the above model. In this paper, firstly, the source of cutting force for conventional cutting of SiCp/Al composites is analyzed, and a cutting force model for conventional cutting is established, which divides the cutting force into four parts: chip forming force, frictional force, labor force and particle breaking force, and the effect of abrasive-enhanced particles is taken into account; secondly, the cutting temperature of pulsed laser–heating-assisted cutting of 25% of SiCp/Al is measured by experiments; lastly, to a more accurate simulation of cutting force, the influence of temperature on the performance of SiCp/Al material was considered, and the temperature-sensitive parameter was correlated with the temperature of pulsed laser heating–assisted cutting of SiCp/Al and introduced into the cutting force model of ordinary cutting of SiCp/Al, so that a cutting force model that considers the influence of laser heating on the performance of SiCp/Al was obtained and experimentally verified. After comparative analysis, the error between the predicted and experimental values is within 20%, which proves the feasibility of the prediction model and provides a theoretical basis for the subsequent pulsed laser heating–assisted SiCp/Al cutting.