<p>Silicon wafers play a pivotal role in semiconductor device manufacturing, and the slicing process is a pivotal step in packaging procedures. In this study, a novel approach for a two-dimensional, multi-focal scribe cutting technique on silicon wafers was proposed to address issues related to excessive energy output from individual-focused lasers along with inefficiency arising due to repetitive cutting. With identical processing parameters but varying the number of laser focus, the cutting depth of the silicon wafer increases first and then decreases with the increase of the focal points, and the multi-focus cutting has little effect on the kerf width. Notably, when there are five foci utilized, it yields optimal cutting quality for silicon wafers. Furthermore, through an investigation on the relationship between different focal depths and laser scanning speed, it has been demonstrated that the multi-focal cutting method offers higher scanning efficiency while dispersing over-ablation caused by the high energy of the single-focus laser. This innovative approach provides valuable technical insights towards achieving high-quality and high-efficiency machining processes for silicon wafer cutting.</p>