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<p>Gamma titanium-aluminum intermetallic compounds demonstrate significant potential for application expansion in aerospace engines due to its superior properties. However, it belongs to difficult-to-cut materials owing to the poor ductility and fracture toughness, presenting significant challenges during grinding processes. The current paper proposes ultrasonic vibration-assisted grinding methods with a single cubic boron nitride grain to reveal the wear behavior and material removal mechanism. Characterizations with average volume pile-up ratio, grinding force, and scratches evolution under different grinding speeds, maximum undeformed chip thicknesses, and ultrasonic amplitudes are conducted. The study shows that compared to CG, the UVAG can reduce the normal grinding force of a single grain by 7.2 to 29.7%, the tangential grinding force by 5.7 to 34.4%, and the average volume pile ratio by approximately 39.3%. The frequent contact of the grains on the workpiece during UVAG results in alternating loads, inducing micro-fracture behavior and ensuring a prolonged high level of cutting edges. The surface quality of the scratches under UVAG is improved due to the simultaneous removal of material by a large number of micro-cutting edges.</p>

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Wear behavior and material removal mechanism during ultrasonic vibration-assisted grinding γ-TiAl materials using a single CBN grain

  • 期刊论文

  • 发表日期：

    2025年2月22日

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  • Xiaowei Wang,
  • Jiahao Song,
  • Hong Xiao,
  • Zhongwei Liang,
  • Xiaojie Qin,
  • Tao Chen,
  • Wenfeng Ding,
  • Biao Zhao

摘要

Gamma titanium-aluminum intermetallic compounds demonstrate significant potential for application expansion in aerospace engines due to its superior properties. However, it belongs to difficult-to-cut materials owing to the poor ductility and fracture toughness, presenting significant challenges during grinding processes. The current paper proposes ultrasonic vibration-assisted grinding methods with a single cubic boron nitride grain to reveal the wear behavior and material removal mechanism. Characterizations with average volume pile-up ratio, grinding force, and scratches evolution under different grinding speeds, maximum undeformed chip thicknesses, and ultrasonic amplitudes are conducted. The study shows that compared to CG, the UVAG can reduce the normal grinding force of a single grain by 7.2 to 29.7%, the tangential grinding force by 5.7 to 34.4%, and the average volume pile ratio by approximately 39.3%. The frequent contact of the grains on the workpiece during UVAG results in alternating loads, inducing micro-fracture behavior and ensuring a prolonged high level of cutting edges. The surface quality of the scratches under UVAG is improved due to the simultaneous removal of material by a large number of micro-cutting edges.