Study on the removal mechanism of Si₃N₄ ceramic material in rotary ultrasonic grinding based on multi-abrasive coupling simulation

Si₃N₄ ceramic has the advantages of high hardness, high strength, corrosion resistance, and high-temperature resistance and is widely used in aerospace and other fields. As a hard and brittle material, it is prone to problems such as difficult control of processing surface quality and low processing efficiency. In order to explore the influence of the interaction between abrasive grains on the surface processing quality and processing efficiency of Si₃N₄ ceramic in rotary ultrasonic grinding, the multigrain grinding simulation is carried out to explore the removal mechanism of Si₃N₄ ceramic material under multigrain coupling. The multi-abrasive scratch test was carried out to verify the simulation. The results show that as the number of abrasive particles increases, the machining forces in both simulations and experiments increase. Meanwhile, the average grinding force per individual abrasive particle decreases. The maximum stress generated by grinding increases first and then decreases as the number of abrasive particles increases. As the number of abrasive particles increases, the depth of surface cracks and the average depth of scratches caused by grinding first decrease and then increase.