Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass by using microgroove grinding

To investigate the effect of microscale grinding on the quality of ITO conductive glass, this paper conducted microscale grinding experiments on ITO conductive glass. The influence of process parameters on machining quality was analyzed using microgrinding force, surface roughness, and sheet resistance as indicators. Meanwhile, soda-lime glass was set as the control group to analyze the effect of ITO film. The results indicate that brittle fracture is the main removal method for ITO films, and the glass substrate exhibits two different removal methods, brittle and ductile, depending on the process parameters. The ITO thin film layer suppresses the sheet deformation of the glass substrate, increasing the grinding force and reducing the processing quality. Increasing the spindle speed, reducing the feed speed, and reducing the cutting depth can improve the machining quality. The spindle speed has a significant impact on surface roughness, while the cutting depth has a significant impact on the sheet resistance of the thin film. In addition, soda-lime glass chips mainly appear in powder and granular form, while ITO conductive glass also has flaky thin film chips generated by interlayer fracture.