Simulation-based optimization of plastic transfer molding parameter for thin small outline package via response surface methodology

Response surface methodology (RSM) is employed to reduce air trap in the thin small outline package (TSOP) manufactured via plastic transfer molding by adjusting the process parameter. The study aims to evaluate the key factors and interactions in transfer molding process parameters of integrated chip (IC) encapsulation. A three-level central composite design (CCD) approach–based response surface methodology analysis was applied to statistically specify the effect of important numerical and categorical process variables (i.e., melt and mold surface temperature, curing time, and runner layout) on the key response process output variables of air trap and curing level. By using this rotatable design, a total of 60 simulation data was fitted. The significance of the factors and their interactions were verified by using the analysis of variance (ANOVA) with a 95% confidence level (p < 0.05). The empirical models were computed and thoroughly validated against the simulation results. The optimum process parameters of the TSOP IC package were characterized as follows: melt temperature of 88.09℃, 181.99℃ of mold surface temperature, the 60 s of curing time, and Herringbone type of cavity layout. The results herein could contribute significantly as a reference and further understanding of the optimization process to advancing microelectronic industries.