Fabrication and performance comparison of mycelium-based composite boards from spent mushroom substrate via dry and wet processing
摘要
In recent years, spent mushroom substrate (SMS) has appeared as a novel form of waste biomass, garnering substantial attention for its treatment and reuse. This study created a biodegradable mycelium-based composite board (MBCB) using SMS via dry and wet processes without chemical additives. Mycelium, a natural adhesive, endowed MBCB with excellent mechanical properties and dimensional stability. The dry method is more conducive to enhancing the mechanical performance of MBCB, yielding a maximum flexural strength of 36.60 MPa and a minimum thermal conductivity of 0.07 W/(m·K), in comparable with the JIS A5905 design standard. In contrast, the wet process effectively lowers water absorption—down to as low as 30.01%—without compromising mechanical characteristics, further increasing the dimensional stability of the MBCB. Combined Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy (XPS) analyses confirm that the enhanced performance of MBCB is primarily credited to the formation of hydrogen bonds between the mycelium and cellulose molecules. Regardless of the process, increased applied pressure boosted MBCB performance more effectively than elevated heating temperature. This approach effectively regulated SMS waste, provided an alternative to conventional fibreboards, contributed to environmental protection and mitigated the shortage of wood resources.